Introduction MVI-250
ASV provides Total Machine Vision Solutions for
semiconductor IC inspection, PCB inspection and inspection
for other electrical parts. Our products include Mark, Lead
& Package defects inspection systems for MLP, QFP, BGA, SOT,
SC70, etc. Our solutions are guaranteed to be
cost-effective, innovative and installed worldwide by major
semiconductor manufacturers.
MVI-250 is a unique multipurpose image processing vision
inspection system which is able to satisfy all measurement
requirements for IC, PCB inspection and other electrical
parts inspection.
Main inspection contents:
- Pattern matching.
- Distance between points, lines.
- Blob measure.
- Angular measurement.
- Circle center measurement.
- Distance between circle centers.
- Lead inspection.
- Mark inspection.
- Package inspection.
Inspection samples:
* IC
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Bend down
|
Scratch
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Void |
Excess Ink |
* PCB
|
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Short
|
Open
|
Pin Hole/Void
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|
|
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Intrusion/Chip |
Protrusion |
Contamination |
*
Others
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(1) Distance measurement
(2) Angular measurement
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Find out the centers of circle
(1) and circle (2)
Calculate the distance between the centers
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|
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Radius measurement |
Others |